In recent years, Mirle Group has fully committed to automation for Fan-Out Panel-Level Packaging (FOPLP) and high-end IC substrates (ABF). Currently, Mirle holds a leading market position in transport and storage equipment—including OHT, AMHS, and EFEM—for panel-level advanced packaging and high-end substrate products. Consequently, Mirle has been selected by major international equipment manufacturers to co-develop next-generation Glass Core Substrate EFEM equipment, jointly entering the "Golden Decade" of new-generation substrates.
Leveraging years of experience in FlatPanel Display (FPD) glass handling, material analysis, and semiconductorsoftware integration, Mirle Group has developed a specialized EFEM for GlassCore Substrates. Designed to address the unique characteristics of glassmaterials across four key processes, this EFEM is engineered for seamlessintegration with various process tools throughout the glass core substrateproduction line.
EFEM for Glass Core Substrate: Technical Highlights
Glass Core Substrates offer significant advantages, including the ability to scale more transistors (enabling more functions and cores), reduced die size, increased interconnect density, larger package form factors, high-speed signal transmission, and overall performance enhancement.
Advantages of Glass Core Substrates
- Thermal Stability & Precision: High temperature resistance with an adjustable Coefficient of Thermal Expansion (CTE) close to Silicon. Excellent flatness minimizes warpage and deformation, effectively improving lithography and packaging processes for Fine Pitch, CD, uBUMP, and Chiplet applications.
- High-Density Connectivity: Superior flatness combined with Through Glass Via (TGV) technology enables high-density, fine-pitch vias ($<100mu m$, increasing density by approximately 10x). This improves signal efficiency and allows for 50% more chips or larger chip designs within the same footprint.
- Power Efficiency: Enables the embedding of inductors and capacitors in higher-temperature processing environments, optimizing power delivery solutions and reducing power consumption for high-speed signals.
- Low Dielectric Loss: Low Dk characteristics facilitate cleaner, noise-free signal routing and power delivery, resulting in low-loss transmission, reduced heat generation, and higher chip efficiency.
- Optical Integration: Enables the seamless integration of optical chip-to-chip interconnects, making Co-Packaged Optics (CPO) implementation significantly easier.
Key Applications of Glass Core Substrate
1.Compared to current organic substrates, glass substrates offer superior flatness and more ideal mechanical properties (including thermal expansion stability). This allows chip architects to design higher-density, higher-performance chips for data-intensive workloads such as AI computing.
2.
Versatile Packaging: Applicable to existing 2.5D, 3D, MEMS, and optical component packaging.
3.Future Development: Industry leaders like Intel plan to transition to glass substrates to improve structural integrity and energy efficiency. Combined with CPO technology, glass designs will increase data bandwidth via optical transmission and support hot-pluggable chip modules.
Future Outlook
As chip performance and packaging density continue to escalate, glass substrates will become the cornerstone for next-generation High-Performance Computing (HPC) and optoelectronic integration. Their role is irreplaceable in supporting the high-speed transmission, high-density interconnects, and Chiplet architectures required by AI chips.
By leveraging its long-standing technical expertise, Mirle Group has taken the lead in deploying EFEM and critical equipment for glass core processes. We will continue to collaborate with international partners to stay at the forefront of next-generation advanced packaging and steadily expand our global semiconductor automation footprint.
Panel-Level Packaging: AMHS/EFEM Solutions
In recent years, Mirle Group has fully committed to automation for Fan-Out Panel-Level Packaging (FOPLP) and high-end IC substrates (ABF). Currently, Mirle holds a leading market position in transport and storage equipment—including OHT, AMHS, and EFEM—for panel-level advanced packaging and high-end substrate products. Consequently, Mirle has been selected by major international equipment manufacturers to co-develop next-generation Glass Core Substrate EFEM equipment, jointly entering the "Golden Decade" of new-generation substrates.
Leveraging years of experience in FlatPanel Display (FPD) glass handling, material analysis, and semiconductorsoftware integration, Mirle Group has developed a specialized EFEM for GlassCore Substrates. Designed to address the unique characteristics of glassmaterials across four key processes, this EFEM is engineered for seamlessintegration with various process tools throughout the glass core substrateproduction line.
EFEM for Glass Core Substrate: Technical Highlights
Glass Core Substrates offer significant advantages, including the ability to scale more transistors (enabling more functions and cores), reduced die size, increased interconnect density, larger package form factors, high-speed signal transmission, and overall performance enhancement.
Advantages of Glass Core Substrates
- Thermal Stability & Precision: High temperature resistance with an adjustable Coefficient of Thermal Expansion (CTE) close to Silicon. Excellent flatness minimizes warpage and deformation, effectively improving lithography and packaging processes for Fine Pitch, CD, uBUMP, and Chiplet applications.
- High-Density Connectivity: Superior flatness combined with Through Glass Via (TGV) technology enables high-density, fine-pitch vias ($<100mu m$, increasing density by approximately 10x). This improves signal efficiency and allows for 50% more chips or larger chip designs within the same footprint.
- Power Efficiency: Enables the embedding of inductors and capacitors in higher-temperature processing environments, optimizing power delivery solutions and reducing power consumption for high-speed signals.
- Low Dielectric Loss: Low Dk characteristics facilitate cleaner, noise-free signal routing and power delivery, resulting in low-loss transmission, reduced heat generation, and higher chip efficiency.
- Optical Integration: Enables the seamless integration of optical chip-to-chip interconnects, making Co-Packaged Optics (CPO) implementation significantly easier.
Key Applications of Glass Core Substrate
1.Compared to current organic substrates, glass substrates offer superior flatness and more ideal mechanical properties (including thermal expansion stability). This allows chip architects to design higher-density, higher-performance chips for data-intensive workloads such as AI computing.
2.
Versatile Packaging: Applicable to existing 2.5D, 3D, MEMS, and optical component packaging.
3.Future Development: Industry leaders like Intel plan to transition to glass substrates to improve structural integrity and energy efficiency. Combined with CPO technology, glass designs will increase data bandwidth via optical transmission and support hot-pluggable chip modules.
Future Outlook
As chip performance and packaging density continue to escalate, glass substrates will become the cornerstone for next-generation High-Performance Computing (HPC) and optoelectronic integration. Their role is irreplaceable in supporting the high-speed transmission, high-density interconnects, and Chiplet architectures required by AI chips.
By leveraging its long-standing technical expertise, Mirle Group has taken the lead in deploying EFEM and critical equipment for glass core processes. We will continue to collaborate with international partners to stay at the forefront of next-generation advanced packaging and steadily expand our global semiconductor automation footprint.
