Press Center

Mirle Establishes "Embodied AI Business Group" to Pioneer Next-Generation Smart Manufacturing with Autonomous Robotics

Mirle Group has officially announced the establishment of its Embodied AI Business Group, marking a strategic leap into the next generation of autonomous robotics.

Panel-Level Packaging: AMHS/EFEM Solutions

In recent years, Mirle Group has fully committed to automation for Fan-Out Panel-Level Packaging (FOPLP) and high-end IC substrates (ABF). Currently, Mirle holds a leading market position in transport and storage equipment—including OHT, AMHS, and EFEM—for panel-level advanced packaging and high-end substrate products.

2025 SEMICON TAIWAN

Wealth Magazine President Hsieh Chin-Ho Leads Investment Delegation to Visit Tongluo Facility

Wealth Magazine President Hsieh Chin-Ho Leads Investment Delegation to Visit Tongluo Facility and Explore the Latest AI Applications in Smart Manufacturing.

Celebrating a Decade of Music and Cultural Roots: Mirle Group Supports Two Commemorative Concerts by the Build Love Association

Mirle Group proudly supports two commemorative concerts by the Build Love Association, which nurtures musical talent among children from rural and Indigenous communities. The events in Hsinchu showcase Taiwan’s cultural richness and growing international exchange through music.

2024 “Angels Come to Shine” Charity Activity

Mirle Group, in cooperation with the HsinChu Christian United Caring Association, Chinese Marketplace Torsion Association, and long-term local partners such as the YWCA, World Vision, Prison Fellowship, and various churches in Hsinchu, has been hosting the “Angels Come to Shine Charity Activity” for five years.

Fan-Out Panel-Level Packaging (FOPLP)

By embedding semiconductor chips directly into large-area panels for fan-out packaging, FOPLP achieves a higher integration level, improved electrical performance, and larger package sizes. Compared to traditional packaging methods, FOPLP enables higher I/O density, effectively enhancing production efficiency and reducing manufacturing costs.

Autonomous Mobile Robot (AMR)

Mirle Baymax AMR is an Autonomous Mobile Robot designed explicitly for semiconductor cleanrooms. It is equipped with a flexible robotic arm and is compact in size, enabling efficient operation in confined spaces, with a maximum load capacity of 25kg.

Mirle Group, KDL, and VEICHI Announce Joint Venture to Forge Ahead in Robotics

Mirle Group Technology Inc., Shenzhen Kedali Industry Co., Ltd., and Suzhou Veichi Electric Co., Ltd. signed a "Joint Venture Agreement" to jointly invest in the establishment of Shenzhen Veidalee Innovation Technology Co., Ltd.

Welcome to Visit Mirle Group@ Booth 1216, 2024SEMICON TAIWAN!

Welcome to Visit Mirle Group@ Booth 1216, 2024SEMICON TAIWAN!

Mirle's Two-Phase Immersion Cooling Technology

Mirle’s two-phase immersion cooling technology draws on the management and design concept of the unmanned room, combining it with the intelligent transportation system, smart cooling system, and operations control center. This innovative and advanced technology enhances the efficiency, reliability, and intelligent management of data centers.

Mirle Group, Shenzhen Kedali, and Main Drive Corporation Establish Joint Venture to Expand in the Global Humanoid Robot Market

Mirle Group, Main Drive Corporation, and Shenzhen Kedali Industry Co. Limited have formed a new joint venture company to enhance overall operational efficiency and expand into the humanoid robot market.