Products
2026.03.12

Panel-Level Packaging: AMHS/EFEM Solutions

In recent years, Mirle Group has fully committed to automation for Fan-Out Panel-Level Packaging (FOPLP) and high-end IC substrates (ABF). Currently, Mirle holds a leading market position in transport and storage equipment—including OHT, AMHS, and EFEM—for panel-level advanced packaging and high-end substrate products.

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Panel-Level Packaging: AMHS/EFEM Solutions
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