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MIRLE has a variety of positions available,both technical and non-technical for talented professionals at all experience levels.
Pioneering Next-Gen Smart Semiconductor Manufacturing with "AI in Motion"
Learn MoreMirle Group has officially announced the establishment of its Embodied AI Business Group, marking a strategic leap into the next generation of autonomous robotics.
Learn MoreIn recent years, Mirle Group has fully committed to automation for Fan-Out Panel-Level Packaging (FOPLP) and high-end IC substrates (ABF). Currently, Mirle holds a leading market position in transport and storage equipment—including OHT, AMHS, and EFEM—for panel-level advanced packaging and high-end substrate products.
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